Small Outline Diode

Small Outline Diode (SOD) is a designation for a group of semiconductor packages for surface mounted diodes. The standard includes multiple variants such as SOD-123, SOD-323, SOD-523 and SOD-923.^[1] SOD-123 is the largest, SOD-923 is the smallest.

References

↑ "Package Outline Dimensions—Suggested Pad Layout" (PDF). Diodes Incorporated. pp. 171–177. Archived from the original (PDF) on 24 April 2015. Retrieved 13 June 2016.

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[DiodesIncorporated-1] "Package Outline Dimensions—Suggested Pad Layout" (PDF). Diodes Incorporated. pp. 171–177. Archived from the original (PDF) on 24 April 2015. Retrieved 13 June 2016.

[1]

v t e Semiconductor packages
Single diode	DO-201 (DO-27) DO-204 (DO-7 / DO-26 / DO-35 / DO-41) DO-213 (MELF / SOD-80 / LL34) DO-214 (SMA / SMB / SMC) SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)
3...5-pin	SOT / TSOT TO-3 (TH / Panel) TO-5 (TH) TO-8 (TH) TO-18 (TH) TO-39 (TH) TO-66 (TH / Panel) TO-92 (TH) TO-126 (TH / Panel) TO-202 (TH / Panel) TO-220 (TH / Panel) TO-247 (TH / Panel) TO-251 (IPAK) (SMT) TO-252 (DPAK) (SMT) TO-262 (I2PAK) (SMT) TO-263 (D2PAK) (SMT) TO-268 (D3PAK) (SMT) TO-273 (Super-220) (SMT) TO-274 (Super-247) (SMT) TO-277 (SMPC, SM-7) (SMT)
Single row	SIP / SIL
Dual row	DFN DIP / DIL Flat Pack MSOP SO / SOIC SOP / SSOP TSOP / HTSOP TSSOP / HTSSOP ZIP
Quad row	LCC QIP / QIL PLCC QFN QFP QUIP / QUIL
Grid array	BGA eWLB LGA PGA
Wafer	COB COF COG CSP Flip Chip PoP QP UICC WL-CSP / WLP
Related topics	Electronic packaging Integrated circuit packaging List of electronic component packaging types Printed circuit board Surface-mount technology Through-hole technology
It is relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.

This page was redesigned at the edge.

References