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BE Semiconductor Industries N.V.
Besi
TypePublic
ISINNL0012866412
IndustrySemiconductors
Founded1995
FoundersRichard Blickman (CEO since 1995)
Headquarters,
The Netherlands
Area served
Worldwide
Revenue€592.8 million (2017)
Number of employees
1819 (2022)
Websitebesi.com

BE Semiconductor Industries N.V., commonly known as Besi, is a Dutch multinational company that designs and manufactures semiconductor equipment.[1][2] Besi offers die attach, packaging, and plating solutions.

History

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The company was founded in May, 1995 by Richard Blickman, who still leads the company today. At the end of 2022, Besi had a total of 1,675 permanent and 144 temporary employees.[3] It outsources production to its subsidiaries in China and Malaysia.[citation needed]

Besi is a publicly traded company, and its shares are listed on the Euronext Amsterdam stock market under the BESI ticker symbol.[4][5] In 2021, Besi was valued at around $5.6 billion.[5]

Products

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Besi offers die attach, packaging and plating solutions, with the die attach segment making up 82% of the revenue in 2021.[6] The segment includes Flip Chip, Hybrid Bonding as well as Thermo Compression products among others.[7][8][9] In total, Besi had a 42% market share in the segment in 2022, making them the market leader.[10] The company's plating products on the other hand are used mainly for solar cells and connectors, as well as other electric devices.[11]

References

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  1. ↑ "BESI.AS - | Stock Price & Latest News | Reuters". www.reuters.com. Retrieved 2023-09-10.
  2. ↑ "BESI:EN Amsterdam Stock Quote - BE Semiconductor Industries NV". Bloomberg.com. Retrieved 2017-06-15.
  3. ↑ "Company Profile". Besi. Retrieved 2023-09-12.
  4. ↑ "BE Semiconductor Industries NV: AMS:BESI quotes & news - Google Finance". www.google.com. Retrieved 2017-06-15.
  5. 1 2 "BE SEMICONDUCTOR | Euronext". www.euronext.com (in Dutch). Retrieved 2019-03-15.
  6. ↑ "Advances in Interconnect and Assembly Technologies for Next Generation Electronic Systems" (PDF). inemi.org. Retrieved 2023-12-13.
  7. ↑ "Advanced Packaging Part 3 – Intel's Curious Bet on Thermocompression Bonding, ASM Pacific, Kulicke and Soffa, and Besi TCB Tool Landscape". semianalysis.com. 2022-01-19. Retrieved 2023-12-13.
  8. ↑ "Products & Technology". besi.com. Retrieved 2023-12-13.
  9. ↑ "Besi holds the best cards in advanced packaging, but the game has only just begun". bits-chips.nl. 2023-11-01. Retrieved 2023-12-13.
  10. ↑ "One Under-the-Radar Semiconductor Stock With 125% Upside, According to Wall Street". fool.com. 2022-10-24. Retrieved 2023-12-13.
  11. ↑ "New Contact Plating Processes Cut Costs, Improve Environmental Impacts". connectorsupplier.com. 2022-03-01. Retrieved 2023-12-13.
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