Draft:Lotus Microsystems
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| Type | Anpartsselskab (ApS)[1] |
|---|---|
| Industry | Electronic components[1] |
| Founded | 16 December 2020[1] |
| Key people |
|
| −€2.981 million (2026)[3] | |
| −€2.590 million (2026)[3] | |
| Total assets | €6.618 million (2026)[3] |
| Total equity | €3.957 million (2026)[3] |
Number of employees | 20 (2026[3]) |
| Website | lotus-microsystems |
Lotus Microsystems ApS is a Danish semiconductor company based in Hvidovre, Denmark.[1][4] It was founded in 2020 as a spin-off from the Technical University of Denmark (DTU).[5][6] The company specialises in designing miniaturised power converters using its proprietary silicon Power Interposer Technology (PIT) that integrates power components while distributing heat through the silicon substrate.[6][7]
The company now applies this technology to high-current power delivery for AI and high-performance computing processors, using vertical power delivery to shorten the power delivery path by placing power conversion beneath the processor instead of routing current laterally across the circuit board.[8][9]
History
[edit]From 2014 to 2018, the TinyPower project was carried out at the Technical University of Denmark, including Hoà Lê Thanh as a PhD student.[10][11] This project sought to reduce the size and cost of switch-mode power supplies through an integrated circuit requiring only a few external components and a miniaturised inductor, all based on an interposer. A later 2017 DTU account also identified Yasser Nour as part of the TinyPower research team; Lê and Nour would go on to co-found Lotus Microsystems.[12][2] The TinyPower work had used higher frequency switching to reduce the size of passive components, and by 2017 the researchers had produced a power supply unit measuring about 1 × 1 cm.[12]
Yasser Nour, who had worked on TinyPower, went on to research semiconductor devices, integrated magnetics, packaging and converter topologies for miniaturising high-frequency power converters in his 2018 DTU doctoral thesis.[12][13] The thesis demonstrated an interposer-based PSiP combining a silicon-embedded toroidal inductor, GaN FETs, and gate drivers and capacitors; the 21 MHz converter reached 83% efficiency and was presented as an intermediate step towards a fully integrated power-supply-on-chip (PwrSoC).[13]
By April 2021, Ahmed Ammar, Nour and Hoà Lê Thanh had developed a miniaturised power converter technology together at the university. Interest from several companies in their early prototypes led to their decision to establish Lotus Microsystems in late 2020 to commercialise the technology. The company's early plans focused on power converters for audio equipment, followed by designs for hearing aids and headphones.[6]
In 2023, Lê and colleagues introduced the Power Interposer Technology (PIT) in an IEEE paper, building upon earlier work on substrate-embedded microinductors, as an integration and packaging platform for power converters. Their passive interposer PSiP integrated a substrate-embedded toroidal microinductor mounting two GaN FETs, a gate driver, and capacitors; this converter achieved a peak efficiency of 83% at 22 MHz with a 1 W output.[11]
Lotus's EIC-funded MicroPower project from late 2022 until 2025 pursued the industrialisation of what was eventually laid out in the 2023 IEEE paper. In a report to CORDIS, Lotus reported the production and validation of engineering samples of PIT and Active Power Interposer Technology (APIT), with the latter directly integrating interposer functions with active power IC wafers. Pilot and pre-production packaging runs of their LMU20P1 were completed, and Lotus's second-generation module integration technology was implemented in LBK0504.[14]
On 8 June 2026, Lotus launched vStrata, its first vertical power delivery platform for AI infrastructure. The LSC0580, its first vStrata module, had taped out for xPU and AI infrastructure partners, with engineering samples slated to ship in Q3 2026.[15][8]
Technology and products
[edit]LMU20P1
[edit]Lotus's power-management products include the LMU20P1, a 100 mA synchronous boost converter in a Power Supply in Package (PSiP). Its circuitry and an inductor come in a 2 mm × 2 mm × 0.75 mm 6-pin land grid array package. The converter operates at a switching frequency of 5 MHz under normal load and uses pulse-frequency modulation at light loads to reduce switching losses and quiescent current.[16]
LBK0504
[edit]The LBK0504 is a synchronous buck converter under development integrating a power management integrated circuit and an inductor within a 2.0 mm × 2.5 mm × 1.1 mm package. It includes an I²C interface for configuration and monitoring, and can operate with up to four phases in parallel to increase the output current. Lotus markets the device for low-noise applications such as optical transceivers, computing point-of-load converters, telecommunications, and medical devices.[17]
vStrata and LSC0580
[edit]vStrata is Lotus's power delivery platform for high-current computing, with the converter placed beneath the processor for vertical power delivery. It combines 3D packaging, thermal management technology, and the Power Interposer Technology.[18] vStrata's first module, the LSC0580, is a fully integrated Power-System-in-Package intended for high-current vertical power delivery. It has an input range of 2.0 V to 5.0 V and an output range of 0.5 V to 1.2 V, while integrating all required passive components within a 9 mm × 9 mm footprint.[19]
HyPIT
[edit]Lotus is also developing Hybrid Power Interposer Technology (HyPIT) through the EUDP-supported RePower-HPC project in conjunction with the Technical University of Denmark and Elplatek. HyPIT is described as a cost-effective and scalable manufacturing technology for advanced silicon power interposers. The project, running from 2026 to 2029, aims to establish a HyPIT pilot line and develop HYPIT-based power modules, including developing their integrated circuits and in-package thermal management. HyPIT is intended for artificial intelligence and high-performance computing systems.[20][21]
References
[edit]- 1 2 3 4 "Lotus Microsystems ApS". Proff (in Danish). Retrieved 23 September 2026.
- 1 2 "Meet our Team". Lotus Microsystems. Retrieved 23 September 2026.
- 1 2 3 4 5 "Lotus Microsystems ApS – Regnskab". Proff (in Danish). Retrieved 23 September 2026.
- ↑ "Lotus Microsystems". chipdesign.dk. Retrieved 24 September 2026.
- ↑ "Spinout companies". DTU Electro. Technical University of Denmark. Retrieved 24 September 2026.
- 1 2 3 "World's smallest power converter ready to go to market". Technical University of Denmark. 7 April 2021. Retrieved 24 September 2026.
- ↑ "Advanced Power & Thermal Management Technology". Lotus Microsystems. Retrieved 24 September 2026.
- 1 2 James, Luke (18 June 2026). "Breaking AI Bottlenecks: 3 Startups Look Beyond the Chip". All About Circuits. Retrieved 24 September 2026.
- ↑ Ye, Zichao; Popovich, Mikhail; Chen, Cheng-Wei; Lu, Jian; Sizikov, Gregory; Gan, Houle (2026). "Towards 10kAmp AI Chip: A System Perspective from Lateral to Vertical Power Delivery". IEEE Transactions on Components, Packaging and Manufacturing Technology. doi:10.1109/TCPMT.2026.3716571. Retrieved 24 September 2026.
- ↑ "TinyPower". DTU Research Database. Technical University of Denmark. Retrieved 23 September 2026.
- 1 2 Le, Hoa Thanh; Nour, Yasser; Jensen, Flemming; Knott, Arnold; Han, Anpan; Ouyang, Ziwei (2023). "Silicon Power Interposer Technology (PIT) for Integrated Power Converter" (PDF). IEEE Transactions on Power Electronics. 38 (6): 6755–6758. doi:10.1109/TPEL.2023.3240357.
- 1 2 3 Frederiksen, Anne Kirsten (28 February 2017). "Wireless energy for the world's smallest and most efficient power supply unit". DTU Electrical Engineering. Technical University of Denmark. Retrieved 24 September 2026.
- 1 2 Nour, Yasser (2018). Miniaturization of High Frequency Power Converters (PhD thesis). Technical University of Denmark. Retrieved 24 September 2026.
- ↑ "The World's Smallest Power Converters – Lotus MicroPower – Periodic Reporting". CORDIS. European Commission. Retrieved 23 September 2026.
- ↑ "Lotus Microsystems Launches First vStrata Module, a Vertical Power Delivery Platform Designed to Break Through Power and Thermal Limits in AI Infrastructure". Lotus Microsystems. 8 June 2026. Retrieved 23 September 2026.
- ↑ "LMU20P1 – Miniaturized Step-Up Power Supply in Package". Lotus Microsystems. Retrieved 23 September 2026.
- ↑ "LBK0504 – Miniaturized 4A Buck Converter". Lotus Microsystems. Retrieved 23 September 2026.
- ↑ "vStrata – Vertical Power Delivery Solutions". Lotus Microsystems. Retrieved 23 September 2026.
- ↑ "LSC0580 – Power Converter for Vertical Point-of-Load Power Delivery". Lotus Microsystems. Retrieved 23 September 2026.
- ↑ "RePower-HPC: Revolutionizing Power Delivery for AI and High-Performance Computing". Lotus Microsystems. 12 March 2026. Retrieved 23 September 2026.
- ↑ "RePower-HPC: Revolutionizing Power Modules for High Energy Efficiency Computing". EUDP. Retrieved 23 September 2026.