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Talk:Copper electroplating

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Latest comment: 9 years ago by Anyafoxy123 in topic Copper plating

Why does when an iron(Fe) nail is plated with copper by imersing it in an Copper(II) Sulfate solution, bubbles were liberated from each of the metal?

This article needs more data

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It's a very stubby stub of an article. (I also deleted the gibberish someone appended to the above.)


It would be nice to have specified voltages and currents listed as well as plating solutions —Preceding unsigned comment added by 67.233.242.153 (talk) 22:26, 29 April 2008 (UTC)Reply

merge with other article

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Its suggested to merge this article with the article Bronzing since there is a very high identity between those two subjects —Preceding unsigned comment added by 217.86.179.64 (talk) 12:19, 9 June 2008 (UTC)Reply

I disagree with the suggestion to merge with Bronzing because the identity between the two pages is only caused by a lack of detailed information about the uses and methods of bronzing. Pesematology (talk) 17:04, 3 December 2008 (UTC)Reply

Plating vs deposition

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"The plating seen in chemistry classes, often obtained with a coin and copper sulphate bath, is in fact deposition as opposed to plating. Subjecting the surface to any wear causes the unstuck deposit to come away. Running such a bath for longer periods, one can often see the grainy like texture of deposition as opposed to the smooth surface of plating."

Very confusing, where on wikipedia can I find the difference between plating and deposition? the page for plating (not copper specific) uses the word deposition to describe plating... Is there a real difference or does "plating seen in chemistry classes" involve a lot of surface inhomogeneities like the bubbles etc making for a more porous substance? An objective difference between plating and deposition would be nice here... — Preceding unsigned comment added by 157.193.10.216 (talk) 17:41, 12 August 2011 (UTC)Reply

Copper plating

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Copper plating is cool. I'm doing it for my science fair. Anyafoxy123 (talk) 22:54, 22 November 2016 (UTC)Reply